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NANO WhEElS; MAxiMuM ADANTAv gES ... wafer) GRINDING CURRENT (Amps) NUMBER OF GRINDS 0 30 60 90 120 150 ... Fine Grind – Z2 >120 μm/wafer
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Fine Grinding Mesh Number Wafer . The major requirement for fine grinding of silicon wafers include: The grit size is mesh # 1200 and the diameter of the wheel is 300 mm
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